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Microscopy services - state-of-the-art facilities

Focused ion beam field emission scanning electron microscope (FIB-FESEM)

• TESCAN S8215G, focused ion beam field emission scanning electron microscope (FIB-FESEM),
• Ga focused ion beam source,
• Secondary and backscatter electron detectors,
• ,
• ,
• Nanomanipulator for lamella liftouts,
• Pt gas injection system.

Left: gas injection system tip, nanomanipulator tip and Cu grid inside the S8000G sample chamber during TEM lamella production,
Right: FIB milled TEM lamella on a nanomanipulator tip during alignment with the Cu post on TEM grid prior to attachment.

FIB-FESEM with integrated TOF-SIMS

• , focused ion beam field emission scanning electron microscope (FIB-FESEM) and integrated time-of-flight secondary ion mass spectrometer (TOF-SIMS),
• Field emission electron source and immersion lens,
• Xe plasma source,
• Secondary and backscatter electron detectors,
• Nanomanipulator for lamella liftouts.

Scanning electron microscopy

• , variable pressure scanning electron microscopes for high resolution imaging (three available),
• Giant and large chambers (GMU and LMU),
• Tungsten filament sources,
• High and low vacuum modes,
• Oxford instruments EDS detectors,
• Secondary and backscatter electron detectors,
• Nordlys Nano EBSD (on GMU).

Hitachi SU5000 field emission scanning electron microscope

• Secondary electron detectors, lower, top and variable pressure,
• 5 segment backscatter detector,
• Conventional and variable pressure modes,
• EDAX TEAM EDS microanalysis system.

Hitachi SU3500 scanning electron microscope

• Tungsten filament,
• Secondary detectors; conventional and variable pressure,
• 5 segment backscatter detector,
• EDAX TEAM EDS microanalysis system,
• Conventional and variable pressure modes.

Additional facilities

• Philips CM20 TEM,
• Bruker D5005 X-ray diffractometers,
• Bruker AFM D3100,
• Bruker DEKTAK,
• Micro Materials NanoTest,
• Spectrometry (Raman, UV-VIS and FTIR),
• Expert sample preparation equipment.